ATMEGA8515-16JU Atmel, ATMEGA8515-16JU Datasheet - Page 2
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ATMEGA8515-16JU
Manufacturer Part Number
ATMEGA8515-16JU
Description
IC MCU AVR 8K 16MHZ IND 44-PLCC
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA8515-16JU
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
EBI/EMI, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-PLCC
Package
44PLCC
Device Core
AVR
Family Name
ATmega
Maximum Speed
16 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
35
Interface Type
SPI/USART
Number Of Timers
2
Processor Series
ATMEGA8x
Core
AVR8
Data Ram Size
512 B
Maximum Clock Frequency
16 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
Cpu Family
ATmega
Device Core Size
8b
Frequency (max)
16MHz
Total Internal Ram Size
512Byte
# I/os (max)
35
Number Of Timers - General Purpose
2
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PLCC
For Use With
ATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK500 - PROGRAMMER AVR STARTER KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Pin Configurations
Figure 1. Pinout ATmega8515
2
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
(RXD) PD0
(INT0) PD2
(INT1) PD3
(XCK) PD4
(SCK) PB7
(TXD) PD1
RESET
NC*
ATmega8515(L)
1
2
3
4
5
6
7
8
9
10
11
TQFP/MLF
33
32
31
30
29
28
27
26
25
24
23
(OC0/T0) PB0
NOTES:
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
NC*
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)
(AIN0) PB2
(AIN1) PB3
(INT0) PD2
(INT1) PD3
(RXD) PD0
(SCK) PB7
(TDX) PD1
(XCK) PD4
(WR) PD6
(RD) PD7
(SS) PB4
(T1) PB1
RESET
XTAL2
XTAL1
1. MLF bottom pad should be soldered to ground.
2. * NC = Do not connect (May be used in future devices)
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PDIP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
(OC1A) PD5
(MOSI) PB5
(MISO) PB6
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
(INT0) PD2
(INT1) PD3
(RXD) PD0
(XCK) PD4
(SCK) PB7
(TXD) PD1
RESET
NC*
7
8
9
10
11
12
13
14
15
16
17
PLCC
39
38
37
36
35
34
33
32
31
30
29
2512K–AVR–01/10
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE0 (ICP/INT2)
NC*
PE1 (ALE)
PE2 (OC1B)
PC7 (A15)
PC6 (A14)
PC5 (A13)