PIC16C56-RCI/SO Microchip Technology, PIC16C56-RCI/SO Datasheet - Page 159
![IC MCU OTP 1KX12 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16C56-RCI/SO
Manufacturer Part Number
PIC16C56-RCI/SO
Description
IC MCU OTP 1KX12 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C56-RCI/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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19.1
PIC16C54C/C55A/C56A/C57C/C58B-40
Param
D001
D002
D003
D004
D010
D020
Note 1: Device operation between 20 MHz to 40 MHz requires the following: V
(Commercial)
No.
2002 Microchip Technology Inc.
* These parameters are characterized but not tested.
† Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus load-
only and is not tested.
Symbol
V
S
externally driven, OSC2 pin not connected, HS oscillator mode and commercial temperatures. For operation
between DC and 20 MHz, See Section 19.1.
ing, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current
consumption.
DC Characteristics:PIC16C54C/C55A/C56A/C57C/C58B-40 (Commercial)
V
V
I
I
a)
b)
POR
VDD
DD
PD
DD
DR
The test conditions for all I
For standby current measurements, the conditions are the same, except that the device is in SLEEP
wave, from rail-to-rail; all I/O pins tristated, pulled to V
abled as specified.
mode. The power-down current in SLEEP mode does not depend on the oscillator type.
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
on Reset
Supply Current
Power-down Current
DD
DD
Start Voltage to ensure
Rise Rate to ensure Power-
Characteristic
(3)
DD
can be lowered in SLEEP mode without losing RAM data.
(3)
DD
measurements in active Operation mode are: OSC1 = external square
(2)
Preliminary
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
0.05*
Min
4.5
—
—
—
—
—
—
Typ† Max Units
1.5*
Vss
5.2
6.8
1.8
9.8
—
—
12.3
27*
5.5
7.0
16
—
—
—
SS
, T0CKI = V
V/ms See Section 5.1 for details on
mA
mA
V
V
V
A
A
0 C
DD
HS mode from 20 - 40 MHz
Device in SLEEP mode
See Section 5.1 for details on
Power-on Reset
Power-on Reset
F
F
V
V
OSC
OSC
DD
DD
DD
between 4.5V to 5.5V, OSC1 pin
= 5.5V, WDT disabled, Commercial
= 5.5V, WDT enabled, Commercial
, MCLR = V
T
= 40 MHz, V
= 40 MHz, V
A
PIC16C5X
+70 C for commercial
Conditions
DD
DS30453D-page 157
DD
DD
; WDT enabled/dis-
= 4.5V, HS mode
= 5.5V, HS mode
(1)
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