PIC18LF25J11-I/ML Microchip Technology, PIC18LF25J11-I/ML Datasheet - Page 12

• Manufacturer Part Number: PIC18LF25J11-I/ML
• Description: IC PIC MCU FLASH 32K 2V 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF25J11-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: EUSART, I2C, SPI
• Maximum Clock Frequency: 31 KHz
• Number Of Programmable I/os: 16
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136, MA180023
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 10
• Height: 0.88 mm
• Length: 6 mm
• Supply Voltage (max): 2.75 V, 3.6 V
• Supply Voltage (min): 2 V
• Width: 6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F46J11 FAMILY
APPENDIX A:
Rev A Document (2/2009)
First release of this document. Silicon issues
1-2 (MSSP), 3 (EUSART), 4 (ADC), 5 (PMP), 6 (Deep
Sleep), 7 (Supply Voltage).
Rev B Document (3/2009)
Modified silicon issues 1 (MSSP) and 3 (EUSART),
and added silicon issue 8 (Special Features – T1DIG).
Rev C Document (4/2009)
Added silicon issue 9 (Master Synchronous Serial Port
(MSSP) – Port 1).
Rev D Document (6/2009)
Revised document to new format. Added silicon issues
10 (10-Bit A/D – Band Gap Reference) and 11 (CTMU).
Rev E Document (10/2009)
Replaced silicon issue 1 (I
1 (MSSP).
1 (Comparator Voltage Reference Module), 2 (28-Pin
QFN Pinout Diagram), 3 (RC4, RC5 Input/Output
Pins), 4 (MSSP Pins), 5 (Watchdog Timer, Features
Summary) and 6 (DC Characteristics).
Rev F Document (12/2009)
Revised silicon issue 6 (Low-Power Modes). Added data
sheet clarification 7 (DC Characteristics – Power-Down
Current).
Rev G Document (4/2010)
Revised silicon issue 5 (Parallel Master Port – PMP).
Added silicon issue 12 (A/D Converter – A/D). Added
data sheet clarification 6 (Section 4.4 “Brown-out
Reset (BOR)”. Renumbered previous data sheet
clarifications 6-7, now 7-8.
Rev H Document (11/2010)
Added data sheet clarification issue 9 (Electrical
Characteristics).
DS80435H-page 12
Added
DOCUMENT
REVISION HISTORY
data
2
C Initialization) with
sheet
clarifications
 2010 Microchip Technology Inc.