PIC18F25K22-I/SP Microchip Technology, PIC18F25K22-I/SP Datasheet - Page 393
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18F25K22-I/SP
Manufacturer Part Number
PIC18F25K22-I/SP
Description
MCU 8BIT 32KB FLASH 5.5V 28SDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F25K22T-ISS.pdf
(10 pages)
4.PIC18F25K22-ISP.pdf
(492 pages)
Specifications of PIC18F25K22-I/SP
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 19x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
7
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F25K22-I/SP
Manufacturer:
MICROCHIP
Quantity:
1 200
- PIC16F722-ISS PDF datasheet
- PIC18F26J13-ISS PDF datasheet #2
- PIC18F25K22T-ISS PDF datasheet #3
- PIC18F25K22-ISP PDF datasheet #4
- Current page: 393 of 496
- Download datasheet (5Mb)
MOVLW
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
2010 Microchip Technology Inc.
Q Cycle Activity:
After Instruction
Decode
W
Q1
=
Move literal to W
MOVLW k
0 k 255
k W
None
The eight-bit literal ‘k’ is loaded into W.
1
1
MOVLW
literal ‘k’
Read
0000
Q2
5Ah
1110
5Ah
Process
Data
Q3
kkkk
Write to W
Q4
kkkk
Preliminary
MOVWF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
PIC18(L)F2X/4XK22
Before Instruction
After Instruction
Decode
W
REG
W
REG
Q1
=
=
=
=
register ‘f’
Move W to f
MOVWF
0 f 255
a [0,1]
(W) f
None
Move data from W to register ‘f’.
Location ‘f’ can be anywhere in the
256-byte bank.
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank.
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f 95 (5Fh). See
Section 25.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode”
1
1
MOVWF
Read
0110
Q2
4Fh
FFh
4Fh
4Fh
REG, 0
f {,a}
111a
Process
Data
Q3
DS41412D-page 393
ffff
for details.
register ‘f’
Write
Q4
ffff
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