PIC16C715-04I/SS Microchip Technology, PIC16C715-04I/SS Datasheet - Page 3
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PIC16C715-04I/SS
Manufacturer Part Number
PIC16C715-04I/SS
Description
IC MCU OTP 2KX14 A/D 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C715-04I/SS
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
For Use With
309-1016 - ADAPTER 20-SSOP TO 18-DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
4.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
2003 Microchip Technology Inc.
Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
β
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
A2
E1
eB
A1
B1
A
E
D
B
n
p
L
c
α
β
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
PIC16C715
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
α
18
10
10
MAX
A2
L
DS80082C-page 3
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15