AT89C55WD-24PU Atmel, AT89C55WD-24PU Datasheet - Page 32

IC 8051 MCU FLASH 20K 40DIP

AT89C55WD-24PU

Manufacturer Part Number
AT89C55WD-24PU
Description
IC 8051 MCU FLASH 20K 40DIP
Manufacturer
Atmel
Series
89Cr
Datasheet

Specifications of AT89C55WD-24PU

Core Processor
8051
Core Size
8-Bit
Speed
24MHz
Connectivity
UART/USART
Peripherals
WDT
Number Of I /o
32
Program Memory Size
20KB (20K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
AT89x
Core
8051
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
UART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
4 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 40 C
Package
40PDIP
Device Core
8051
Family Name
89C
Maximum Speed
24 MHz
Cpu Family
AT89
Device Core Size
8b
Frequency (max)
24MHz
Total Internal Ram Size
256Byte
# I/os (max)
32
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
40
Package Type
PDIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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39. Package Information
39.1
32
Notes:
44A – TQFP
AT89C55WD
R
2325 Orchard Parkway
San Jose, CA 95131
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
3. Lead coplanarity is 0.10 mm maximum.
C
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
e
PIN 1
0˚~7˚
L
PIN 1 IDENTIFIER
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
D1
D
B
E1
A1
E
A2
SYMBOL
A
A
A1
A2
D
D1
E
E1
B
C
L
e
11.75
11.75
0.30
0.05
9.90
9.90
0.09
0.45
COMMON DIMENSIONS
MIN
0.95
(Unit of Measure = mm)
0.80 TYP
12.00
10.00
12.00
10.00
NOM
1.00
DRAWING NO.
12.25
10.10
12.25
10.10
MAX
1.20
0.15
1.05
0.45
0.20
0.75
44A
1921D–MICRO–6/08
10/5/2001
Note 2
Note 2
NOTE
REV.
B

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