PIC16F870T-I/SS Microchip Technology, PIC16F870T-I/SS Datasheet - Page 6
![IC MCU FLASH 2KX14 EE 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC16F870T-I/SS
Manufacturer Part Number
PIC16F870T-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F870-ISO.pdf
(172 pages)
4.PIC16F870-ISO.pdf
(6 pages)
Specifications of PIC16F870T-I/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
For Use With
I3-DB16F871 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC16F870/871
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Analog-to-Digital (A/D) Converter Module .................................................................................................................................. 79
11.0 Special Features of the CPU ...................................................................................................................................................... 87
12.0 Instruction Set Summary .......................................................................................................................................................... 103
13.0 Development Support............................................................................................................................................................... 111
14.0 Electrical Characteristics .......................................................................................................................................................... 117
15.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 137
16.0 Packaging Information.............................................................................................................................................................. 149
Appendix A: Revision History............................................................................................................................................................. 157
Appendix B: Device Differences......................................................................................................................................................... 157
Appendix C: Conversion Considerations ........................................................................................................................................... 158
Appendix D: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 158
Appendix E: Migration from High-End to Enhanced Devices............................................................................................................. 159
Index .................................................................................................................................................................................................. 161
On-Line Support................................................................................................................................................................................. 167
Systems Information and Upgrade Hot Line ...................................................................................................................................... 167
Reader Response .............................................................................................................................................................................. 168
PIC16F870/871 Product Identification System .................................................................................................................................. 169
DS30569B-page 4
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150.
We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
• The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include
literature number) you are using.
Customer Notification System
Register on our web site at www.microchip.com/cn to receive the most current information on all of our products.
Device Overview .......................................................................................................................................................................... 5
Memory Organization ................................................................................................................................................................. 11
Data EEPROM and Flash Program Memory.............................................................................................................................. 27
I/O Ports ..................................................................................................................................................................................... 33
Timer0 Module ........................................................................................................................................................................... 45
Timer1 Module ........................................................................................................................................................................... 49
Timer2 Module ........................................................................................................................................................................... 53
Capture/Compare/PWM Modules .............................................................................................................................................. 55
Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART)................................................................ 61
http://www.microchip.com
TO OUR VALUED CUSTOMERS
2003 Microchip Technology Inc.