PIC18F45K20-I/ML Microchip Technology, PIC18F45K20-I/ML Datasheet - Page 4
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PIC18F45K20-I/ML
Manufacturer Part Number
PIC18F45K20-I/ML
Description
IC PIC MCU FLASH 16KX16 44QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(12 pages)
3.PIC18F25K20T-ISS.pdf
(14 pages)
4.PIC18F25K20T-ISS.pdf
(456 pages)
5.PIC18F45K20-IPT.pdf
(78 pages)
6.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F45K20-I/ML
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
44-QFN
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
CCP/ECCP/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Package
44QFN EP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240313 - BOARD DEMO 8BIT XLPAC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPDM164124 - KIT STARTER FOR PIC18F4XK20AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F24K20/25K20/44K20/45K20
Silicon Errata Issues
1. Module: ECCP
2. Module: ECCP
3. Module: MSSP SPI
DS80425G-page 4
Note 1: This document summarizes all silicon
Changing the CCP1M<3:0> bits of CCP1CON
may cause the CCPR1H and CCPR1L registers to
capture the value of Timer1.
Work around
Halt Timer1 before changing ECCP mode. Reload
Timer1 with desired value after ECCP is setup and
before Timer1 is restarted.
Affected Silicon Revisions
Changing direction in Full-Bridge mode does not
insert dead time between changing the active
drivers in common legs of the bridge.
Work around
None.
Affected Silicon Revisions
When the SPI clock is configured for Timer2/2
(SSPCON1<3:0> = 0011), the first SPI high time
may be short.
Work around
Option 1: Ensure TMR2 value rolls over to zero
Option 2: Turn Timer2 off and clear TMR2 before
Affected Silicon Revisions
X
X
X
2: Shaded cells in this section indicate latest
errata issues from all specified revisions
of silicon.
silicon in production.
X
X
X
writing SSPBUF. Enable TMR2 after
SSPBUF is written.
immediately before writing to SSPBUF.
X
X
X
X
X
X
4. Module: MSSP I
5. Module: ADC
6. Module: MSSP I
Slew rate is slower than I
the SLRCON<2> bit is set.
Work around
Clear SLRCON<2> bit when using the I
peripheral.
Affected Silicon Revisions
Offset error is 3 LSb typical, 7 LSb maximum,
including
component (~2 LSb).
Work around
The time dependent error is insignificant when the
time between conversions is less than 100 ms.
When the time since the previous conversion is
greater than 100 ms then take two ADC
conversions and discard the first.
Affected Silicon Revisions
If a new address byte is received while the BF flag
is set, the SSPOV bit is properly set and an ACK is
not properly generated. If only the SSPOV bit is set
(BF flag was cleared) and a matching address is
clocked in, that received byte will be improperly
loaded into the SSPBUF register and an ACK will
be improperly generated.
Work around
None.
Affected Silicon Revisions
X
X
X
X
X
X
an
X
X
X
2010 Microchip Technology Inc.
acquisition
2
2
X
X
X
C™
C
2
C specifications when
time-dependent
2
C