PIC16C54-LPI/P Microchip Technology, PIC16C54-LPI/P Datasheet - Page 180
![IC MCU OTP 512X12 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C54-LPI/P
Manufacturer Part Number
PIC16C54-LPI/P
Description
IC MCU OTP 512X12 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16LC58B-04P.pdf
(194 pages)
Specifications of PIC16C54-LPI/P
Core Processor
PIC
Core Size
8-Bit
Speed
40kHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
768B (512 x 12)
Program Memory Type
OTP
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 6.25 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
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PIC16C5X
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
DS30453D-page 178
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
Dimension Limits
E1
E
Units
A2
A1
E1
E
D
B
n
p
A
L
c
Preliminary
MIN
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
4
5
5
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
0.05
0.25
1.73
1.63
7.59
7.06
0.56
0.10
0.00
5.11
0
0
MILLIMETERS
2002 Microchip Technology Inc.
NOM
101.60
0.65
1.85
1.73
0.15
7.85
5.25
7.20
0.75
0.18
0.32
20
5
5
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
10
10
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