PIC16C715-04E/P Microchip Technology, PIC16C715-04E/P Datasheet

IC MCU OTP 2KX14 A/D 18DIP

PIC16C715-04E/P

Manufacturer Part Number
PIC16C715-04E/P
Description
IC MCU OTP 2KX14 A/D 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C715-04E/P

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
PIC16C715
PIC16C715 Data Sheet Errata
The PIC16C715 parts you have received conform
functionally to the Device Data Sheet (DS30272A),
except for the anomalies described below.
None.
 2003 Microchip Technology Inc.
DS80082C-page 1

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PIC16C715-04E/P Summary of contents

Page 1

... PIC16C715 Data Sheet Errata The PIC16C715 parts you have received conform functionally to the Device Data Sheet (DS30272A), except for the anomalies described below. None.  2003 Microchip Technology Inc. PIC16C715 DS80082C-page 1 ...

Page 2

... In the Device Data Sheet (DS30272A), the following clarifications and corrections should be noted. 1. Module: Core (DC Characteristics) Section 13.3 has changed as shown below. 13.3 DC Characteristics: PIC16C715-04 (Commercial, Industrial, Extended) PIC16C715-10 (Commercial, Industrial, Extended) PIC16C715-20 (Commercial, Industrial, Extended) PIC16LC715-04 (Commercial, Industrial) DC CHARACTERISTICS Param Characteristic No ...

Page 3

... B1 .045 .058 .070 B .014 .018 .022 eB .310 .370 .430 α β PIC16C715 α MILLIMETERS MIN NOM MAX 18 2.54 3.56 3.94 4.32 2.92 3.30 3.68 0.38 7.62 7.94 8.26 6.10 6.35 6.60 22.61 22.80 22.99 3.18 3 ...

Page 4

... PIC16C715 18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC 45° c β Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width ...

Page 5

... B1 .050 .055 .060 B .016 .019 .021 eB .345 .385 .425 W1 .130 .140 .150 W2 .190 .200 .210 PIC16C715 MILLIMETERS MIN NOM MAX 18 2.54 4.32 4.64 4.95 3.94 4.06 4.19 0.38 0.57 0.76 7.62 7.94 8.26 7.24 7.37 7.49 22.35 22 ...

Page 6

... PIC16C715 20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP β Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top ...

Page 7

... First revision of this document. Rev. B Document 6/2001 Under Clarifications/Corrections to the Data Sheet, added issue 2 (Analog-to-Digital Converter) and issue 3 (Core). Rev. C Document 3/2003 Under Clarifications/Corrections to the Data Sheet, Item 4, Packaging: correct package data was added.  2003 Microchip Technology Inc. PIC16C715 DS80082C-page 7 ...

Page 8

... PIC16C715 NOTES: DS80082C-page 8  2003 Microchip Technology Inc. ...

Page 9

... MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP service mark of Microchip Technology Incorporated in the U.S.A. ...

Page 10

... Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No ...

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