PIC16F887-E/P Microchip Technology, PIC16F887-E/P Datasheet - Page 24

• Manufacturer Part Number: PIC16F887-E/P
• Description: IC PIC MCU FLASH 8KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F887-E/P

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 35
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/USART
• On-chip Adc: 14-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 368 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53273-916
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD
• Lead Free Status / Rohs Status: Details

PIC16F882/883/884/886/887
2.2
The data memory (see Figures 2-2 and
partitioned into four banks which contain the General
Purpose Registers (GPR) and the Special Function
Registers (SFR). The Special Function Registers are
located in the first 32 locations of each bank. The
General Purpose Registers, implemented as static RAM,
are located in the last 96 locations of each Bank.
Register locations F0h-FFh in Bank 1, 170h-17Fh in
Bank 2 and 1F0h-1FFh in Bank 3, point to addresses
70h-7Fh in Bank 0. The actual number of General
Purpose Resisters (GPR) implemented in each Bank
depends on the device. Details are shown in Figures 2-5
and 2-6. All other RAM is unimplemented and returns ‘0’
when read. RP<1:0> of the STATUS register are the
bank select bits:
RP1 RP0
2.2.1
The register file is organized as 128 x 8 in the
PIC16F882, 256 x 8 in the PIC16F883/PIC16F884, and
368 x 8 in the PIC16F886/PIC16F887. Each register is
accessed, either directly or indirectly, through the File
Select Register (FSR) (see Section 2.4 “Indirect
Addressing, INDF and FSR Registers”).
2.2.2
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the “core” are described in this section.
Those related to the operation of the peripheral
features are described in the section of that peripheral
feature.
DS41291F-page 22
0
0
1
1
0
1
0
1
Data Memory Organization
→Bank 0 is selected
→Bank 1 is selected
→Bank 2 is selected
→Bank 3 is selected
GENERAL PURPOSE REGISTER
FILE
SPECIAL FUNCTION REGISTERS
2-3) is
© 2009 Microchip Technology Inc.