PIC12CE673-04I/P Microchip Technology, PIC12CE673-04I/P Datasheet - Page 89

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PIC12CE673-04I/P

Manufacturer Part Number
PIC12CE673-04I/P
Description
IC MCU OTP 1KX14 A/D&EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr

Specifications of PIC12CE673-04I/P

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Oscillator Type
Internal
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
16Byte
Ram Memory Size
128Byte
Cpu Speed
4MHz
No.
RoHS Compliant
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12CE673-04I/P
Manufacturer:
Microchip Technology
Quantity:
135
12.0
Absolute Maximum Ratings †
Ambient temperature under bias...............................................................................................................–40° to +125°C
Storage temperature ............................................................................................................................. –65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by GPIO pins combined ...................................................................................................100 mA
Maximum current sourced by GPIO pins combined..............................................................................................100 mA
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: Pdis = V
1999 Microchip Technology Inc.
ELECTRICAL SPECIFICATIONS FOR PIC12C67X
DD
with respect to V
IK
OK
(V
DD
SS
I
(V
< 0 or V
pin ..............................................................................................................................150 mA
O
pin ...........................................................................................................................200 mA
< 0 or V
SS
SS
I
SS
> V
................................................................................................................ 0 to +7.0V
(Note 2)..................................................................................................0 to +14V
O
(except V
DD
> V
)
DD
)
DD
and MCLR)................................................... –0.3V to (V
DD
x {I
DD
-
I
OH
} +
{(V
DD
PIC12C67X
- V
OH
) x I
OH
DS30561B-page 89
} + (V
DD
O
+ 0.3V)
l x I
20 mA
20 mA
OL
).

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