PIC12C671T-10I/SM Microchip Technology, PIC12C671T-10I/SM Datasheet - Page 10

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PIC12C671T-10I/SM

Manufacturer Part Number
PIC12C671T-10I/SM
Description
IC MCU OTP 1KX14 A/D 8-SOIJ
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets

Specifications of PIC12C671T-10I/SM

Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
For Use With
AC164312 - MODULE SKT FOR PM3 16SOIC309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
PIC12C67X
8.
Added 8-Lead Plastic Micro Leadframe Package (MF)
and (MLF-S).
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
DS80067C-page 10
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
Module:
A1
n
PACKAGING INFORMATION
1
TOP VIEW
2
E1
E
Dimension Limits
Units
D1
D2
A2
A1
A3
E1
E2
D
R
n
p
A
E
B
L
D1
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
MILLIMETERS*
2001 Microchip Technology Inc.
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12

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