PIC16C57C-04I/SP Microchip Technology, PIC16C57C-04I/SP Datasheet - Page 183

IC MCU OTP 2KX12 28DIP

PIC16C57C-04I/SP

Manufacturer Part Number
PIC16C57C-04I/SP
Description
IC MCU OTP 2KX12 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C57C-04I/SP

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
20
Program Memory Size
3KB (2K x 12)
Program Memory Type
OTP
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
For Use With
DVA16XP280 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16C57C-04I/SP
Manufacturer:
MICROCHIP
Quantity:
545
Part Number:
PIC16C57C-04I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
2002 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
W
n
E1
eB
E
Dimension Limits
§
2
1
Units
A2
eB
A1
E1
B1
c
W
A
E
D
B
n
p
L
c
D
A1
A
MIN
1.430
Preliminary
.195
.155
.015
.595
.514
.125
.008
.050
.016
.610
.270
INCHES*
NOM
1.460
.100
.210
.160
.038
.600
.520
.138
.010
.058
.020
.660
.280
28
MAX
1.490
.225
.165
.060
.625
.526
.150
.012
.065
.023
.710
.290
B
B1
MIN
13.06
36.32
15.49
15.11
4.95
3.94
0.38
3.18
0.20
1.27
6.86
0.41
MILLIMETERS
NOM
15.24
37.08
16.76
13.21
PIC16C5X
2.54
5.33
4.06
0.95
3.49
0.25
1.46
p
0.51
7.11
28
A2
DS30453D-page 181
MAX
15.88
13.36
37.85
18.03
L
5.72
4.19
1.52
0.30
1.65
0.58
7.37
3.81

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