PIC18F26K20T-I/SS Microchip Technology, PIC18F26K20T-I/SS Datasheet - Page 232
![IC PIC MCU FLASH 32KX16 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC18F26K20T-I/SS
Manufacturer Part Number
PIC18F26K20T-I/SS
Description
IC PIC MCU FLASH 32KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
Specifications of PIC18F26K20T-I/SS
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC18F26K20T-I/SSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F26K20T-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC18F25K20T-ISS PDF datasheet
- PIC18F25K20T-ISS PDF datasheet #2
- PIC18F26K20-ISS PDF datasheet #3
- PIC18F26K20-ISS PDF datasheet #4
- Current page: 232 of 456
- Download datasheet (4Mb)
PIC18F2XK20/4XK20
17.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<7:0> and
counts down to 0. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 17-29:
FIGURE 17-30:
DS41303G-page 232
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 17-29).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 17-30.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
T
Cleared by software
2010 Microchip Technology Inc.
BRG
Interrupt cleared
by software
‘0’
‘0’
‘0’
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