PIC12C509-04E/P Microchip Technology, PIC12C509-04E/P Datasheet - Page 4

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PIC12C509-04E/P

Manufacturer Part Number
PIC12C509-04E/P
Description
IC MCU OTP 1KX12 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr

Specifications of PIC12C509-04E/P

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
OTP
Ram Size
41 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
For Use With
DVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
PIC12C508/509
2.
The package information contained in the data sheet is
incorrect. Please refer to the following tables for correct
package data.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS80023C-page 4
Module: Packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
p
A
E
D
B
α
n
L
c
β
c
D
MIN
.045
.140
.115
.015
.300
.240
.360
.125
.008
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15

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