PIC16F688-E/ML Microchip Technology, PIC16F688-E/ML Datasheet - Page 127
![IC PIC MCU FLASH 4KX14 16QFN](/photos/6/65/66536/mfg_mcp7386x_qfn_sml.jpg)
PIC16F688-E/ML
Manufacturer Part Number
PIC16F688-E/ML
Description
IC PIC MCU FLASH 4KX14 16QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(204 pages)
3.PIC16F688T-ISL.pdf
(6 pages)
4.PIC16F688T-ISL.pdf
(4 pages)
5.PIC16F688T-ISL.pdf
(688 pages)
Specifications of PIC16F688-E/ML
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
16-QFN
Controller Family/series
PIC16F
No. Of I/o's
12
Eeprom Memory Size
256Byte
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
2
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART, RS- 232, SCI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT16QFN1 - SOCKET TRANSITION 14DIP TO 16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
Lead Free Status / Rohs Status
Details
11.6
The Power-down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
• WDT will be cleared but keeps running.
• PD bit in the Status register is cleared.
• TO bit is set.
• Oscillator driver is turned off.
• I/O ports maintain the status they had before SLEEP
For lowest current consumption in this mode, all I/O
pins should be either at V
circuitry drawing current from the I/O pin, and the
comparators and CV
that are high-impedance inputs should be pulled high
or low externally to avoid switching currents caused by
floating inputs. The T0CKI input should also be at V
or
contribution from on-chip pull-ups on PORTA should be
considered.
The MCLR pin must be at a logic high level.
11.6.1
The device can wake-up from Sleep through one of the
following events:
1.
2.
3.
The first event will cause a device Reset. The two latter
events are considered a continuation of program
execution. The TO and PD bits in the Status register
can be used to determine the cause of device Reset.
The PD bit, which is set on power-up, is cleared when
Sleep is invoked. TO bit is cleared if WDT wake-up
occurred.
The following peripheral interrupts can wake the device
from Sleep:
1.
2.
3.
4.
5.
6.
7.
8.
© 2009 Microchip Technology Inc.
was executed (driving high, low or high-impedance).
Note:
V
External Reset input on MCLR pin.
Watchdog
enabled).
Interrupt from RA2/INT pin, PORTA change or a
peripheral interrupt.
Timer1 interrupt. Timer1 must be operating as
an asynchronous counter.
A/D conversion (when A/D clock source is FRC).
EEPROM write operation completion.
Comparator output changes state.
Interrupt-on-change.
External Interrupt from INT pin.
EUSART Receive Interrupt.
ULPWU Interrupt.
SS
Power-Down Mode (Sleep)
for
WAKE-UP FROM SLEEP
It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
lowest
Timer
REF
current
wake-up
should be disabled. I/O pins
DD
or V
SS
consumption.
(if
, with no external
WDT
was
The
DD
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
11.6.2
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
• If the interrupt occurs during or after the
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes.
To determine whether a SLEEP instruction executed,
test the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
Note:
SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
execution of a SLEEP instruction, the device will
immediately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT prescaler
and postscaler (if enabled) will be cleared, the TO
bit will be set and the PD bit will be cleared.
If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt enable bit and the correspond-
ing interrupt flag bits set, the device will
immediately wake-up from Sleep. The
SLEEP instruction is completely executed.
WAKE-UP USING INTERRUPTS
PIC16F688
DS41203E-page 125