PIC16F631-E/P Microchip Technology, PIC16F631-E/P Datasheet - Page 241

• Manufacturer Part Number: PIC16F631-E/P
• Description: IC PIC MCU FLASH 1KX14 20DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F631-E/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 18
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• For Use With: 658-1047-5 - BOARD EVALUATION ACCESSTOUCHAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOICACICE0203 - MPLABICE 20P 300 MIL ADAPTER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Connectivity: -

17.5
© 2008 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
DD
A
JA
JC
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
PIC16F631/677/685/687/689/690
A
≤ +125°C
108.1
Typ.
62.4
85.2
28.1
24.2
32.2
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
OL
(T
+ P
x V
DIE
) + Σ (I
DD
I
/
O
- T
DS41262E-page 239
A
OH
)/θ
* (V
JA
DD
- V
OH
))