PIC16F1827-E/SS Microchip Technology, PIC16F1827-E/SS Datasheet - Page 327
PIC16F1827-E/SS
Manufacturer Part Number
PIC16F1827-E/SS
Description
MCU PIC 8BIT 4K FLASH 20-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16F1826-IP.pdf
(406 pages)
3.PIC16F1826-IP.pdf
(12 pages)
4.PIC16F1826-IP.pdf
(8 pages)
5.PIC16F1826-IP.pdf
(40 pages)
Specifications of PIC16F1827-E/SS
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
15
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F1827-E/SS
Manufacturer:
MICROCHIP
Quantity:
3 290
Company:
Part Number:
PIC16F1827-E/SS
Manufacturer:
MIC
Quantity:
200
- PIC16F722-ISS PDF datasheet
- PIC16F1826-IP PDF datasheet #2
- PIC16F1826-IP PDF datasheet #3
- PIC16F1826-IP PDF datasheet #4
- PIC16F1826-IP PDF datasheet #5
- Current page: 327 of 406
- Download datasheet (4Mb)
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 27-4 for more
information.
FIGURE 27-4:
2010 Microchip Technology Inc.
External
Programming
Signals
TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
Clock
Data
V
V
V
DD
PP
SS
*
To Normal Connections
Preliminary
*
V
DD
*
PIC16F/LF1826/27
*
Isolation devices (as required).
V
MCLR/V
V
ICSPDAT
ICSPCLK
Device to be
Programmed
DD
SS
PP
DS41391C-page 327
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