PIC16F676T-E/SL Microchip Technology, PIC16F676T-E/SL Datasheet - Page 2
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PIC16F676T-E/SL
Manufacturer Part Number
PIC16F676T-E/SL
Description
IC MCU FLASH 1KX14 W/AD 14 SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F629T-ISN.pdf
(24 pages)
3.PIC16F630-ISL.pdf
(132 pages)
4.PIC16F630-ISL.pdf
(2 pages)
5.PIC16F630-ISL.pdf
(10 pages)
Specifications of PIC16F676T-E/SL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
PIC16F630/676
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (DS40039E), the following
clarifications and corrections should be noted.
1. Module: Product Identification System
FIGURE 1:
DS80185F-page 2
Device:
Temperature Range:
Package:
Pattern:
PART NO.
In the Product Identification System description,
the package “SOIC (Gull wing, 3.90 mm body) lists
the package code as SN. The correct package
code for this device is SL. “Example b” should read
I/SL, as shown in bold print in Figure 1 below.
Device
PRODUCT IDENTIFICATION SYSTEM
Temperature
PIC16F6XX:
PIC16F6XXT V
I
E
P
SL
ST
3-Digit Pattern Code for QTP (blank otherwise).
Range
X
=
=
=
=
=
PDIP
SOIC (Gull Wing, 3.90 mm body)
TSSOP (4.4mm)
-40°C to +85°C
-40°C to +125°C
Standard V
DD
range 2.0V to 5.5V (Tape and Reel)
Package
DD
/XX
range 2.0V to 5.5V
Pattern
XXX
Examples:
a)
b)
PIC16F630 - E/P 301 = Extended Temp.,
PDIP package, 20 MHz, QTP pattern #301.
PIC16F676 - I/SL = Industrial Temp.,
SOIC package, 20 MHz.
© 2007 Microchip Technology Inc.