PIC16F616-E/ST Microchip Technology, PIC16F616-E/ST Datasheet - Page 213

• Manufacturer Part Number: PIC16F616-E/ST
• Description: IC PIC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F616-E/ST

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 11
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 11
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Height: 0.9 mm
• Length: 5 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 4.4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F610/616/16HV610/616, PIC16F610/616/16HV610/
616T
I
E
H
ML
P
SL
ST
QTP, SQTP or ROM Code; Special Requirements
(blank otherwise)
Range
(1)
X
=
=
=
=
= -40°C to
= -40°C to +125°C
= -40°C to +150°C
Quad Flat No Leads (QFN)
Plastic DIP (PDIP)
14-lead Small Outline (3.90 mm) (SOIC)
Thin Shrink Small Outline (4.4 mm) (TSSOP)
Package
/XX
+85°C
PIC16F610/616/16HV610/616
(Industrial)
(Extended)
(High Temp.)
Pattern
XXX
(2)
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
j)
k)
l)
m)
Note 1:
PIC16F610-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC16F616-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
PIC16HV610-E/P 301 = Extended Temp.,
PDIP package, 20 MHz, QTP pattern #301
PIC16HV616-E/P 301 = Extended Temp.,
PDIP package, 20 MHz, QTP pattern #301
PIC16F610-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16F616-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16HV610-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16HV616-I/SL = Industrial Temp., SOIC
package, 20 MHz
PIC16F610T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16F616T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16HV610T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16HV616T-E/ST Tape and Reel, Extended
Temp., TSSOP package, 20 MHz
PIC16F616 - H/SL = High Temp., SOIC pack-
age, 20 MHz.
2:
T
and QFN packages only.
High Temp. available for PIC16F616 only.
= in tape and reel for TSSOP, SOIC
.
DS41288F-page 213