PIC16F54T-E/SO Microchip Technology, PIC16F54T-E/SO Datasheet - Page 79
![IC MCU FLASH 512X12 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F54T-E/SO
Manufacturer Part Number
PIC16F54T-E/SO
Description
IC MCU FLASH 512X12 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16F54T-E/SO
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
768B (512 x 12)
Program Memory Type
FLASH
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
© 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
D
A
E
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
7.80
1.75
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
PIC16F5X
8°
–
DS41213D-page 77
φ
L