PIC16F54-E/SS Microchip Technology, PIC16F54-E/SS Datasheet - Page 73
![IC MCU FLASH 512X12 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F54-E/SS
Manufacturer Part Number
PIC16F54-E/SS
Description
IC MCU FLASH 512X12 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16F54-E/SS
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
12
Program Memory Size
768B (512 x 12)
Program Memory Type
FLASH
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
© 2007 Microchip Technology Inc.
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
E1
A2
.115
.015
.300
.240
.880
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
PIC16F5X
–
DS41213D-page 71
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