MCF53013CQT240 Freescale Semiconductor, MCF53013CQT240 Datasheet - Page 7

MCU 32BIT COLDFIRE EMAC 208LQFP

MCF53013CQT240

Manufacturer Part Number
MCF53013CQT240
Description
MCU 32BIT COLDFIRE EMAC 208LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5301xr
Datasheet

Specifications of MCF53013CQT240

Core Processor
Coldfire V3
Core Size
32-Bit
Speed
240MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, PWM, WDT
Number Of I /o
61
Program Memory Size
16KB (16K x 8)
Program Memory Type
Cache
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Processor Series
MCF5301x
Core
ColdFire V3
Data Bus Width
32 bit
Data Ram Size
128 KB
Interface Type
UART, I2C, SPI, SSI, Ethernet
Maximum Clock Frequency
20 MHz to 400 MHz
Number Of Programmable I/os
61
Number Of Timers
8
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M53015EVB, M53017KIT, M53017MOD
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
3.3.1
If EV
connected to the EV
before IV
there will be high current in the internal ESD protection diodes. The rise times on the power supplies should be slower than 1
microsecond to avoid turning on the internal ESD protection clamp diodes.
The recommended power up sequence is as follows:
3.3.2
If IV
state. There is no limit on how long after IV
not lag EV
the ESD protection diodes. There are no requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
Freescale Semiconductor
1.
2.
1.
2.
DD
DD
/PV
/SDV
Use 1 microsecond or slower rise time for all supplies.
IV
EV
regulator.
Drop IV
Drop EVDD/SDVDD supplies.
Notes:
1
2
3
4
DD
DD
DD
DD
IV
Recommended that IV
Input voltage must not be greater than the supply voltage (EV
at any time, including during power-up.
Use 1 microsecond or slower rise time for all supplies.
DD
must power up. IV
, SDV
DD
DD
Power Up Sequence
Power Down Sequence
/PV
are powered down first, then sense circuits in the I/O pads will cause all output drivers to be in a high impedance
/SDV
3.3V
2.5V
1.2V
1.8V
DD
should not exceed EV
are powered up with the IV
DD
DD
0
DD
/PV
DD
and EV
, or PV
/SDV
DD
going to the higher external voltages. One way to accomplish this is to use a low drop-out voltage
Figure 3. Supply Voltage Sequencing and Separation Cautions
to 0V.
DD
DD
DD
DD
to be in a high impedance state. There is no limit on how long after EV
/SDV
1
going low by more than 0.4V during power down or there will be undesired high current in
DD
should not lead the EV
/PV
Preliminary—Subject to Change Without Notice
DD
DD
2
DD
should track up to 0.9V and then separate for the completion of ramps with
, SDV
DD
should track EV
DD
and PV
DD
MCF5301x Data Sheet, Rev. 5
at 0V, then the sense circuits in the I/O pads will cause all pad output drivers
or PV
DD
Supplies Stable
DD
power down before EV
DD
DD
by more than 0.4V at any time, including power-up.
, SDV
/SDV
DD
DD
up to 0.9V then separate for completion of ramps
or PV
DD
, SDV
DD
DD
DD
by more than 0.4V during power ramp up or
, IV
or SDV
DD
, or PV
Hardware Design Considerations
DD
EV
IV
SDV
SDV
must power down. IV
DD
DD
DD
, PV
DD
DD
) by more than 0.5V
, USBV
(2.5V - DDR)
(1.8V - DDR)
DD
DD
DD
/SDV
Time
(3.3V)
DD
powers up
DD
should
7

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