PIC18F448-I/P Microchip Technology, PIC18F448-I/P Datasheet - Page 7
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PIC18F448-I/P
Manufacturer Part Number
PIC18F448-I/P
Description
IC MCU FLASH 8KX16 CAN 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18LF242-ISO.pdf
(36 pages)
2.PIC18F248-ISO.pdf
(402 pages)
3.PIC18F248-ISO.pdf
(8 pages)
Specifications of PIC18F448-I/P
Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Oscillator Type
External
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
33
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI, I2C, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
33
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136, DM163011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Details
Other names
PIC18F448I/P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F448-I/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC18F448-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F448-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
3.0
3.1
Erasing code or data EEPROM is accomplished by
writing an “erase option” to address 3C0004h. Code
memory may be erased portions at a time, or the user
may erase the entire device in one action. “Bulk Erase”
operations will also clear any code protect settings
associated with the memory block erased. Erase
options are detailed in Table 3-1.
TABLE 3-1:
The actual Bulk Erase function is a self-timed opera-
tion. Once the erase has started (falling edge of the 4th
SCLK after the WRITE command), serial execution will
cease until the erase completes (parameter P11). Dur-
ing this time, SCLK may continue to toggle, but SDATA
must be held low.
The code sequence to erase the entire device is shown
in Figure 3-2 and the flowchart is show in Figure 3-1.
FIGURE 3-2:
2010 Microchip Technology Inc.
Chip Erase
Erase Data EEPROM
Erase Boot Block
Erase Panel 1
Erase Panel 2
Erase Panel 3
Erase Panel 4
SCLK
SDATA
Note:
DEVICE PROGRAMMING
High Voltage ICSP Bulk Erase
4-bit Command
1
A bulk erase is the only way to reprogram
code protect bits from an on state to an off
state.
0
2
Description
0
3
1
BULK ERASE OPTIONS
4
1
BULK ERASE TIMING
P5
1
0
Data Payload
2
0
16-bit
15 16
0
0
P5A
4-bit Command
1
0
Data
80h
81h
83h
88h
89h
8Ah
8Bh
2
0
3
0
SDATA = Input
4
0
P5
1
0
2
0
TABLE 3-2:
FIGURE 3-1:
NOP
Command
0000
0000
0000
0000
0000
0000
1100
0000
0000
4-Bit
15 16
0
0
P5A
4-bit Command
PIC18FXX2/XX8
Payload
1
0
0E 3C
6E F8
0E 00
6E F7
0E 04
6E F6
00 80
00 00
00 00
Data
2
0
Delay P11+P10
BULK ERASE COMMAND
SEQUENCE
Load Address
Entire Device
3
0
Pointer to
Write 80h
3C0004h
to Erase
4
BULK ERASE FLOW
Done
Time
0
Start
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 04h
MOVWF TBLPTRL
Write 80h TO 3C0004h to
erase entire device.
NOP
Hold SDATA low until
erase completes.
Erase Time
Core Instruction
P11
DS39576C-page 7
Data Payload
P10
16-bit
1
n
2
n