PIC18F2539-I/SO Microchip Technology, PIC18F2539-I/SO Datasheet - Page 304
![IC MCU FLASH 12KX16 EE AD 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F2539-I/SO
Manufacturer Part Number
PIC18F2539-I/SO
Description
IC MCU FLASH 12KX16 EE AD 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2439-ISO.pdf
(322 pages)
3.PIC18F2439-ISO.pdf
(6 pages)
4.PIC18F2439-ISO.pdf
(34 pages)
Specifications of PIC18F2539-I/SO
Core Size
8-Bit
Program Memory Size
24KB (12K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1408 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
21
Eeprom Memory Size
256Byte
Ram Memory Size
1.375KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1408 B
Interface Type
I2C, SPI, AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
DV164005, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Details
- PIC16F616T-ISL PDF datasheet
- PIC18F2439-ISO PDF datasheet #2
- PIC18F2439-ISO PDF datasheet #3
- PIC18F2439-ISO PDF datasheet #4
- Current page: 304 of 322
- Download datasheet (7Mb)
PIC18FXX39
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30485A-page 302
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
β
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
E
D
B
n
p
L
φ
c
α
β
n
MIN
Preliminary
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
φ
D1
0
5
5
L
CH x 45 °
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
2002 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
44
10
10
11
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7
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