PIC18F66J60-I/PT Microchip Technology, PIC18F66J60-I/PT Datasheet - Page 463

• Manufacturer Part Number: PIC18F66J60-I/PT
• Description: IC PIC MCU FLASH 32KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F66J60-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 41.667MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 39
• Ram Size: 3808 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3808 B
• Interface Type: Display Driver/Ethernet/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 41.667 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 11-ch x 10-bit
• Package: 64TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 41.667 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162064 - HEADER INTFC MPLABICD2 64/80/100AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F97J60 FAMILY
APPENDIX A:
REVISION HISTORY
Revision A (March 2006)
Original data sheet for the PIC18F97J60 family of
devices.
Revision B (October 2006)
First revision. Includes preliminary electrical specifica-
tions; revised and updated material on the Ethernet
module; updated material on Reset integration; and
updates to the device memory map.
Revision C (June 2007)
Corrected Table 10.2: Input Voltage Levels; added con-
tent on Ethernet module’s reading and writing to the
buffer; added new, 100-lead PT 12x12x1 mm TQFP
package to “Package Marking Information” and “Pack-
age Details” sections; updated other package details
drawings; changed Product Identification System
examples.
Revision D (January 2008)
Added one line to “Ethernet Features” description.
Added land pattern schematics for each package.
Revision E (October 2009)
Updated to remove Preliminary status.
© 2009 Microchip Technology Inc.
DS39762E-page 463