PIC16F882-I/SP Microchip Technology, PIC16F882-I/SP Datasheet - Page 269
PIC16F882-I/SP
Manufacturer Part Number
PIC16F882-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F882-ISO.pdf
(288 pages)
Specifications of PIC16F882-I/SP
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
EUSART/MSSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
28
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
11
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F882-I/SP
Manufacturer:
IR
Quantity:
3 000
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- PIC16F882-ISO PDF datasheet #5
- Current page: 269 of 288
- Download datasheet (5Mb)
28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
© 2006 Microchip Technology Inc.
Note:
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Drawing No. C04-073
B
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
c
p
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
E1
E
Dimension Limits
Units
A2
E1
A1
n
p
A
E
D
L
c
B
2
1
PIC16F882/883/884/886/887
L
D
MIN
.065
.002
.295
.390
.022
.004
.197
.009
Preliminary
0°
-
A1
INCHES
NOM
A
28
.026
.307
.402
.030
.069
.209
4°
-
-
-
-
MAX
.073
.323
.220
.413
.037
.010
.015
.079
8°
-
MIN
1.65
0.05
5.00
9.90
0.55
0.22
7.49
0.09
0°
-
MILLIMETERS*
NOM
28
10.20
0.65
1.75
7.80
5.30
0.75
4°
-
-
-
-
Revised 1-12-06
A2
DS41291C-page 267
MAX
10.50
8.20
5.60
0.95
0.25
0.38
1.85
2.00
8°
-
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