PIC12F675-I/MD Microchip Technology, PIC12F675-I/MD Datasheet - Page 5

• Manufacturer Part Number: PIC12F675-I/MD
• Description: IC PIC MCU FLASH 1KX14 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F675-I/MD

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-DFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53270-913
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164326 - MODULA SKT PM3 20QFN
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F629/675
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev. A Document (3/2002)
First revision of this document. Revised Table 12.3
Rev. B Document (9/2002)
Added Module 1: “In-Circuit Serial Programming™”,
changes made to the Typical In-Circuit Serial Program-
ming Connection, Figure 9-18.
Rev. C Document (04/02/04)
Removed Table 12.3 and Figure 9-18 due to Data
Sheet revisions.
Added Module 1: “GPIO Port”, changes made to the
TRISIO – GPIO Tri-state Register.
Rev. D Document (11/2004)
Added Module 1: “Data EEPROM Memory” for
PIC12F629/675 silicon.
Rev. E Document (07/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 2: New 4x4 DFN Package added.
Rev. F Document (10/2005)
Data
Sheet
Clarifications/Corrections
Section:
Replaced 8-Lead Plastic Dual Flat No Lead Package
4x4 (DFN).
Rev. G Document (8/2006)
Added Module 2: “Power-on Reset (Rising V
DD
Detect)” for PIC12F629/675 silicon.
Rev. H Document (6/2009)
Updated the document with new format. Deleted
Module 1 and 2 from the Data Sheet Clarification
section. Updated Table 1 and 2. Other minor edits.
© 2009 Microchip Technology Inc.
DS80125H-page 5