PIC16F636-I/ST Microchip Technology, PIC16F636-I/ST Datasheet - Page 6

• Manufacturer Part Number: PIC16F636-I/ST
• Description: IC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F636-I/ST

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number Of I /o: 11
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Package: 14TSSOP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162057 - MPLAB ICD 2 HEADER 14DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F636/639
APPENDIX A:
REVISION HISTORY
Rev A Document (8/2004)
Issue 1 – When OPTION_REG bits, PS<2:0>, are
clear, multiple spurious Resets can occur when the
WDT times out.
Added Clarifications/Corrections to the Data Sheet,
Issues 1, 2 and 3 (changed to 8-pin MF saw
singulated packaging).
Rev B Document (01/2005)
Added PIC16F639 device.
Revised Module 1: Resets.
Deleted Clarification/Corrections to the Data Sheet.
Data Sheet has been updated.
Rev C Document (07/2005)
Data Sheet Clarifications/Corrections Section: Added
Module 1: New 4x4 QFN Package added.
Rev D Document (02/2006)
Data Sheet Clarifications/Corrections Section: Added
Module 2: I/O Pins.
Rev E Document (03/2006)
Data Sheet Clarifications/Corrections section: Added
Module 3: Data EEPROM Memory; Added Module 4:
Electrical Specifications. Replaced QFN Package
Drawing.
Rev F Document (06/2006)
Added Module 2: “Wake-up Reset (WUR)”, and Module
3: “Internal/External Clock Switch Over”.
Rev G Document (11/2006)
Added Module 4: “Data EEPROM Memory”.
Data Sheet Clarifications/Corrections section: removed
all sections, data sheet updated (DS41232C).
Rev H Document (06/2010)
Updated Errata to new format. Added Silicon Revisions
A1, B3 and B4.
Data Sheet Clarification: Added Module 1.
 2010 Microchip Technology Inc.
DS80204H-page 6