PIC10F204-I/MC Microchip Technology, PIC10F204-I/MC Datasheet - Page 45

• Manufacturer Part Number: PIC10F204-I/MC
• Description: IC PIC MCU FLASH 256X12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F204-I/MC

• Core Size: 8-Bit
• Program Memory Size: 384B (256 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Program Memory Type: FLASH
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC10
• No. Of I/o's: 4
• Ram Memory Size: 16Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: DFN
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Package: 8DFN EP
• Device Core: PIC
• Family Name: PIC10
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC103003 - BOARD DEMO PIC10F CAP TOUCHAC163020-2 - ADAPTER PROGRAM PIC10F 2X3 DFN
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

DIP DEVICE FOOTPRINTS
TQFP/PLCC DEVICE FOOTPRINTS
© 2009 Microchip Technology Inc.
Appendix A. Header Target Footprints
To connect a header board directly to a target board (without the use of a transition
socket) the following information will be helpful.
• DIP Device Footprints
• TQFP/PLCC Device Footprints
DIP device adapter footprints shown will accept adapter plugs like Samtec series APA
plugs. These plugs can be soldered in place during development/emulation and
eliminate the need for any other sockets.
FIGURE 27:
TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec
series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during
development/emulation and eliminate the need for any other sockets.
FIGURE 28:
0.028 DIA
PLATED-THRU
HOLES
0.050
0.100
DIP FOOTPRINT
SINGLE-ROW TQFP/PLCC FOOTPRINT
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of DIP is 40-pin.
0.800
0.028 DIA
PLATED-THRU
HOLES
0.800
C
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
8-Pin
14-Pin
18-Pin
20-Pin
28-Pin
40-Pin
DIP
0.300
0.300
0.300
0.300
0.300
0.600
C
DS51292R-page 45