MC9S08QE16CLC Freescale Semiconductor, MC9S08QE16CLC Datasheet - Page 30

• Manufacturer Part Number: MC9S08QE16CLC
• Description: MCU 8BIT 16K FLASH 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE16CLC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 50.33MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 1KB
• # I/os (max): 40
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 10-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: LQFP
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 50.33 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 12
• Operating Supply Voltage: - 0.3 V to + 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Ordering Information
4
This section contains ordering information for the MC9S08QE32 series of MCUs.
Example of the device numbering system:
5
5.1
The following pages are mechanical drawings for the packages described in
available drawings please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
30
Pin Count
48
44
32
28
Ordering Information
Package Information
Mechanical Drawings
(MC = Fully Qualified)
Quad Flat No-Leads
Low Quad Flat Package
Low Quad Flat Package
Small Outline Integrated Circuit
(9 = Flash-based)
Package Type
Memory
Status
Family
Core
MC9S08QE32 Series MCU Data Sheet, Rev. 6
MC
Table 19. Package Descriptions
9 S08
QE 32
Abbreviation
LQFP
LQFP
SOIC
QFN
C
XX
Designator
Temperature range
Package designator (see
Approximate flash size in kbytes
(C = –40 °C to 85 °C)
WL
LD
LC
FT
Table
Case No.
824D
873A
1314
751F
19. For the latest
Table
Freescale Semiconductor
19)
Document No.
98ASS23225W
98ARH99048A
98ASH70029A
98ASB42345B