AT32UC3A3256-CTUT Atmel, AT32UC3A3256-CTUT Datasheet - Page 64

• Manufacturer Part Number: AT32UC3A3256-CTUT
• Description: IC MCU AVR32 256KB FLASH 144TBGA
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3A3256-CTUT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 110
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-TBGA
• Processor Series: AT32UC3x
• Core: AVR32
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: IrDA/SCI/SCIF/UDI
• Maximum Clock Frequency: 66 MHz
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
• Minimum Operating Temperature: - 40 C
• For Use With: ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

13. Mechanical Characteristics
13.1
13.1.1
13.1.2
32058HS–AVR32–03/09
Thermal Considerations
Thermal Data
Junction Temperature
Table 13-1
Table 13-1.
The average chip-junction temperature, T
where:
• θ
• θ
• θ
• P
• T
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
64.
Table 13-1 on page
Consumption” on page
JA
JC
JA
JC
JA
JC
HEAT SINK
A
D
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
T
T
J
J
=
=
T
summarizes the thermal resistance data depending on the package.
= cooling device thermal resistance (°C/W), provided in the device datasheet.
T
A
A
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
64.
θ
HEATSINK
JA
44.
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
TQFP100
TQFP100
LQFP144
LQFP144
Package
AT32UC3A
Table 13-1 on page
43.4
39.8
Typ
5.5
8.9
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
64