PIC18F6680-I/PT Microchip Technology, PIC18F6680-I/PT Datasheet - Page 31

IC PIC MCU FLASH 32KX16 64TQFP

PIC18F6680-I/PT

Manufacturer Part Number
PIC18F6680-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6680-I/PT

Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C/SPI/AUSART/CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6680-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F6680-I/PT
Manufacturer:
Microch
Quantity:
480
5.4
To allow portability of code, a PIC18FXX80/XX85
programmer is required to read the Configuration Word
locations from the HEX file. If Configuration Word infor-
mation is not present in the HEX file, then a simple
warning message should be issued. Similarly, while
saving a HEX file, all Configuration Word information
must be included. An option to not include the Configu-
ration Word information may be provided. When
embedding Configuration Word information in the HEX
file, it should start at address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
 2010 Microchip Technology Inc.
Embedding Configuration Word
Information in the HEX File
5.5
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The Configuration Word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-4 (pages 32 through 35) describes how to
calculate the checksum for each device.
Note:
PIC18FXX80/XX85
Checksum Computation
The checksum calculation differs depend-
ing on the code-protect setting. Since the
code memory locations read out differently
depending on the code-protect setting, the
table describes how to manipulate the
actual code memory values to simulate
the values that would be read from a
protected device. When calculating a
checksum by reading a device, the entire
code memory can simply be read and
summed. The Configuration Word and ID
locations can always be read.
DS39606E-page 31

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