PIC18F8585-I/PT Microchip Technology, PIC18F8585-I/PT Datasheet - Page 11

• Manufacturer Part Number: PIC18F8585-I/PT
• Description: IC PIC MCU FLASH 24KX16 80TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F8585-I/PT

• Core Size: 8-Bit
• Program Memory Size: 48KB (24K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TFQFP
• Controller Family/series: PIC18
• No. Of I/o's: 69
• Eeprom Memory Size: 1024Byte
• Ram Memory Size: 3.25KB
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3328 B
• Interface Type: I2C, SPI, AUSART, CAN
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 69
• Number Of Timers: 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163015
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 80TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
• Lead Free Status / Rohs Status: Details

FIGURE 3-3:
3.2
Programming code memory is accomplished by first
loading data into the appropriate write buffers and then
initiating a programming sequence. Each panel in the
code memory space (see Figure 2-4) has an 8-byte
deep write buffer that must be loaded prior to initiating
a write sequence. The actual memory write sequence
takes the contents of these buffers and programs the
associated EEPROM code memory.
Typically, all of the program buffers are written in paral-
lel (Multi-Panel Write mode). For example, in the case
of a 64-Kbyte device (8 panels with an 8-byte buffer per
panel), 64 bytes will be simultaneously programmed
during each programming sequence. In this case, the
offset of the write within each panel is the same (see
Figure 3-4). Multi-Panel Write mode is enabled by
appropriately configuring the Programming Control
register located at 3C0006h.
 2010 Microchip Technology Inc.
Code Memory Programming
MULTI-PANEL SINGLE ROW ERASE CODE MEMORY FLOW
Addr = Addr + 64
No
The programming duration is externally timed and is
controlled by PGC. After a “Start Programming” com-
mand is issued (4-bit command, ‘1111’), a NOP is
issued, where the 4th PGC is held high for the duration
of the programming time, P9.
After PGC is brought low, the programming sequence
is terminated. PGC must be held low for the time spec-
ified by parameter P10 to allow high-voltage discharge
of the memory array.
The code sequence to program a PIC18FXX80/XX85
device is shown in Table 3-4. The flowchart shown in
Figure 3-5 depicts the logic necessary to completely
write a PIC18FXX80/XX85 device. The timing diagram
that details the “Start Programming” command and
parameters P9 and P10 is shown in Figure 3-6.
Start Erase Sequence
and Hold PGC High
Multi-Panel Erase
Note:
Delay P9 + P10
Time for Erase
until Done
Device for
Configure
to Occur
PIC18FXX80/XX85
Panels
Done?
Start
Done
All
Yes
Addr = 0
The TBLPTR register must contain the
same offset value when initiating the pro-
gramming sequence as it did when the
write buffers were loaded.
DS39606E-page 11