PIC32MX460F512L-80I/PT Microchip Technology, PIC32MX460F512L-80I/PT Datasheet - Page 19
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PIC32MX460F512L-80I/PT
Manufacturer Part Number
PIC32MX460F512L-80I/PT
Description
IC PIC MCU FLASH 512K 100-TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheets
1.MA320002.pdf
(208 pages)
2.DM320001.pdf
(44 pages)
3.PIC32MX320F032H-40IPT.pdf
(48 pages)
4.PIC32MX320F032H-40IPT.pdf
(66 pages)
5.PIC32MX320F032H-40IPT.pdf
(22 pages)
6.PIC32MX460F256L-80IPT.pdf
(632 pages)
7.PIC32MX320F064H-40IMR.pdf
(172 pages)
Specifications of PIC32MX460F512L-80I/PT
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-TFQFP
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C , SPI , UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5 x 16 bit, 1 x 32 bit
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Controller Family/series
PIC32
No. Of I/o's
85
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
6
Embedded Interface Type
EUART, I2C, PSP, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKDM320003 - BOARD DEMO USB PIC32 OTGAC244006 - KIT MPLAB REAL ICE TRACEAC164333 - MODULE SKT FOR PM3 100QFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX460F512L-80I/PT
Manufacturer:
VISHAY
Quantity:
3 200
Company:
Part Number:
PIC32MX460F512L-80I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and tim-
ing requirements information in the respective device
Flash programming specification for information on
capacitive loading limits and pin input voltage high (V
and input low (V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3, and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
2.6
The TMS, TDO, TDI, and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended, with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
© 2009 Microchip Technology Inc.
Guide” DS51331
User's Guide” DS51616
®
ICSP Pins
JTAG
ICD 2, MPLAB
®
®
®
®
ICD 2 In-Circuit Debugger User's
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Debugger
IL
®
®
®
) requirements.
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
REAL ICE™” (poster) DS51749
®
ICD 3, or MPLAB
®
REAL
Preliminary
IH
)
Pull-up resistors, series diodes, and capacitors on the
TMS, TDO, TDI, and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete compo-
nents are an application requirement, they should be
removed from the circuit during programming and
debugging. Alternately, refer to the AC/DC characteris-
tics and timing requirements information in the respec-
tive device Flash programming specification for
information on capacitive loading limits and pin input
voltage high (V
2.7
The trace pins can be connected to a hardware-trace-
enabled programmer to provide a compress real time
instruction trace. When used for trace the TRD3,
TRD2, TRD1, TRD0, and TRCLK pins should be dedi-
cated for this use. The trace hardware requires a 22
Ohm series resistor between the trace pins and the
trace connector.
2.8
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 "Oscillator
Configuration" for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
PIC32MX3XX/4XX
Trace
External Oscillator Pins
IH
) and input low (V
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
IL
) requirements.
DS61143F-page 17
Main Oscillator
Guard Trace
Guard Ring
Secondary
Oscillator