PIC18F4585-I/ML Microchip Technology, PIC18F4585-I/ML Datasheet - Page 6

• Manufacturer Part Number: PIC18F4585-I/ML
• Description: IC MCU FLASH 24KX16 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4585-I/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.25K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 11x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Core: PIC
• Processor Series: PIC18F
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 40 MHz
• Data Ram Size: 3.25 KB
• On-chip Adc: 11 bit
• Number Of Programmable I/os: 44
• Number Of Timers: 1 x 8
• Operating Supply Voltage: 4.2 V to 5.5 V
• Mounting Style: SMD/SMT
• Height: 0.88 mm
• Interface Type: I2C, SPI, EUSART
• Length: 8 mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 8 mm
• For Use With: XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNI3-DB18F4680 - BOARD DAUGHTER ICEPIC3444-1001 - DEMO BOARD FOR PICMICRO MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F2585/2680/4585/4680
REVISION HISTORY
Rev A Document (05/2006)
First revision of this document, split from DS80202
(previous
“PIC18F2585/2680/4585/4680
Rev.
A1
Silicon/Data Sheet Errata”). Includes previous data
sheet clarification issues 1 (DC Characteristics) and
2 (MOVFF Instruction), reordered as issues 1 (Instruc-
tion Set) and 2 (DC Characteristics). Added issues
3 (DC Characteristics: Power-Down and Supply
Current), 4 (DC Characteristics – Voltage-Frequency
Graph) and 5 (Table 27-6: External Clock Timing
Requirements).
Rev B Document (11/2007)
Removed data sheet clarification issues 1 (Instruction
Set), 2 (DC Characteristics), 4 (DC Characteristics –
Voltage-Frequency Graph and 5 (External Clock Tim-
ing Requirements). Removed portions of issue 3 – now
issue 1 (Electrical Characteristics) – that had been
updated in the data sheet, but retained changes that
had not been incorporated. Added data sheet
clarification
issues
2
(ECAN™
Technology),
3 (Electrical Characteristics), 4 (Master Synchronous
Serial Port (MSSP) – Serial Peripheral Interface (SPI))
and 5 (Enhanced Capture/Compare/PWM (ECCP1)
Module).
© 2007 Microchip Technology Inc.
DS80272B-page 6