DSPIC33FJ256GP510A-I/PF Microchip Technology, DSPIC33FJ256GP510A-I/PF Datasheet - Page 327
![IC MCU 16BIT 256KB FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ256GP510A-I/PF
Manufacturer Part Number
DSPIC33FJ256GP510A-I/PF
Description
IC MCU 16BIT 256KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
2.DSPIC33FJ256GP506A-IPT.pdf
(8 pages)
3.DSPIC33FJ128GP306A-IPT.pdf
(350 pages)
Specifications of DSPIC33FJ256GP510A-I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
256KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
85
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
32-chx10-bit|32-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP510A-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ64GP206A-IMR PDF datasheet
- DSPIC33FJ256GP506A-IPT PDF datasheet #2
- DSPIC33FJ128GP306A-IPT PDF datasheet #3
- Current page: 327 of 338
- Download datasheet (3Mb)
2009 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
dsPIC33FJXXXGPX06A/X08A/X10A
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
D
A
E
α
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
DS70593B-page 327
A2
α
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