DSPIC33FJ256MC510-I/PT Microchip Technology, DSPIC33FJ256MC510-I/PT Datasheet - Page 35
![IC DSPIC MCU/DSP 256K 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
DSPIC33FJ256MC510-I/PT
Manufacturer Part Number
DSPIC33FJ256MC510-I/PT
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.DSPIC33FJ64MC506-IPT.pdf
(340 pages)
3.DSPIC33FJ64MC506-IPT.pdf
(30 pages)
Specifications of DSPIC33FJ256MC510-I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
256KB
Supply Voltage Range
3V To 3.6V
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
85
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
24-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDMA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256MC510-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ256MC510-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
5.4
5.4.1
Flash memory write and erase operations are
controlled by the NVMCON register. Programming is
performed by setting NVMCON to select the type of
erase
(Table
the WR control bit (NVMCON<15>).
In ICSP mode, all programming operations are
self-timed. There is an internal delay between the user
setting the WR control bit and the automatic clearing of
the WR control bit when the programming operation is
complete. Please refer to
Characteristics and Timing Requirements”
detailed information about the delays associated with
various programming operations.
TABLE 5-2:
FIGURE 5-5:
© 2010 Microchip Technology Inc.
0x404F
0x404D
0x404C
0x4042
NVMCON
Value
V
PGDx
PGCx
MCLR
DD
5-3) and initiating the programming by setting
operation
Flash Memory Programming in
ICSP Mode
PROGRAMMING OPERATIONS
Erase all code memory, executive
memory and CodeGuard™ Configuration
registers (does not erase Unit ID or
Device ID registers).
Erase General Segment and FGS
Configuration register.
Erase Secure Segment and FSS
Configuration register. This operation will
also erase the General Segment and
FGS Configuration register.
Erase a page of code memory or
executive memory.
NVMCON ERASE OPERATIONS
P14
(Table
P6
ENTERING ICSP™ MODE
Erase Operation
5-2)
P21
Section 8.0 “AC/DC
or
P18
write
V
b31
IH
0
operation
b30
1
Program/Verify Entry Code = 0x4D434851
b29
for
0
b28
P1A
0
P1B
b27
TABLE 5-3:
5.4.2
The WR bit (NVMCON<15>) is used to start an erase
or write cycle. Setting the WR bit initiates the
programming cycle.
All erase and write cycles are self-timed. The WR bit
should be polled to determine if the erase or write cycle
has been completed. Starting a programming cycle is
performed as follows:
1
0x4001
0x4000
0x4003
NVMCON
Value
...
BSET
b3
0
STARTING AND STOPPING A
PROGRAMMING CYCLE
Program 1 row (64 instruction words)
of code memory or executive memory.
Write a Configuration register byte.
Program a code memory word.
NVMCON, #WR
NVMCON WRITE OPERATIONS
b2
0
b1
0
V
IH
Write Operation
b0
1
P19
DS70152H-page 35
P7