DSPIC33FJ64GS610-I/PT Microchip Technology, DSPIC33FJ64GS610-I/PT Datasheet - Page 8
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DSPIC33FJ64GS610-I/PT
Manufacturer Part Number
DSPIC33FJ64GS610-I/PT
Description
IC MCU/DSP 64KB FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Specifications of DSPIC33FJ64GS610-I/PT
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
85
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
85
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
On-chip Dac
10 bit, 4 Channel
Core Frequency
40MHz
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
85
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64GS610-I/PT
Manufacturer:
Microchip
Quantity:
253
Company:
Part Number:
DSPIC33FJ64GS610-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64GS610-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
APPENDIX A:
REVISION HISTORY
Rev A Document (10/2009)
Initial release of this document; issued for revision A0.
Includes silicon issues 1 (ECAN), 2 (SPI), 3 (SPI)
4 (JTAG), 5 (PWM) and 6 (Interrupts).
Rev B Document (6/2010)
Removed silicon issue 2 (SPI) and marked its location
as reserved.
Updated the work around in silicon issue 5 (PWM).
Added silicon issues 7 (ADC), 8 (PWM) and 9
(High
Speed
PWM) and data sheet clarification 1
(DC
Characteristics: I/O Pin Input
Specifications).
Rev C Document (11/2010)
Updated the Device IDs in
Table 1
for the following
devices:
• dsPIC33FJ32GS606
• dsPIC33FJ32GS608
• dsPIC33FJ32GS610
• dsPIC33FJ64GS406
• dsPIC33FJ64GS606
• dsPIC33FJ64GS608
Added silicon issue 10 (ECAN).
© 2010 Microchip Technology Inc.
DS80489C-page 8