PIC18LF2620-I/SO Microchip Technology, PIC18LF2620-I/SO Datasheet - Page 6
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PIC18LF2620-I/SO
Manufacturer Part Number
PIC18LF2620-I/SO
Description
IC MCU FLASH 32KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F2525-ISO.pdf
(412 pages)
4.PIC18F2525-ISO.pdf
(18 pages)
5.PIC18F2525-ISO.pdf
(18 pages)
6.PIC18F2525-ISO.pdf
(6 pages)
7.PIC18F2525-ISO.pdf
(6 pages)
Specifications of PIC18LF2620-I/SO
Core Size
8-Bit
Program Memory Size
64KB (32K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
1024Byte
Ram Memory Size
3.875KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3986 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF2620-I/SO
Manufacturer:
PLX
Quantity:
101
Part Number:
PIC18LF2620-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F2525/2620/4525/4620
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................. 109
11.0 Timer0 Module ......................................................................................................................................................................... 123
12.0 Timer1 Module ......................................................................................................................................................................... 127
13.0 Timer2 Module ......................................................................................................................................................................... 133
14.0 Timer3 Module ......................................................................................................................................................................... 135
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 139
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 201
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223
20.0 Comparator Module.................................................................................................................................................................. 233
21.0 Comparator Voltage Reference Module ................................................................................................................................... 239
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243
23.0 Special Features of the CPU .................................................................................................................................................... 249
24.0 Instruction Set Summary .......................................................................................................................................................... 267
25.0 Development Support............................................................................................................................................................... 317
26.0 Electrical Characteristics .......................................................................................................................................................... 321
27.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 361
28.0 Packaging Information.............................................................................................................................................................. 383
Appendix A: Revision History............................................................................................................................................................. 393
Appendix B: Device Differences......................................................................................................................................................... 394
Appendix C: Conversion Considerations ........................................................................................................................................... 395
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 395
Appendix E: Migration from Mid-Range TO Enhanced Devices ........................................................................................................ 396
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 396
Index .................................................................................................................................................................................................. 397
The Microchip Web Site ..................................................................................................................................................................... 407
Customer Change Notification Service .............................................................................................................................................. 407
Customer Support .............................................................................................................................................................................. 407
Reader Response .............................................................................................................................................................................. 408
PIC18F2525/2620/4525/4620 Product Identification System ............................................................................................................ 409
DS39626E-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 53
Data EEPROM Memory ............................................................................................................................................................. 73
Flash Program Memory .............................................................................................................................................................. 79
8 x 8 Hardware Multiplier............................................................................................................................................................ 89
I/O Ports ..................................................................................................................................................................................... 91
© 2008 Microchip Technology Inc.