PIC24FJ192GA110-I/PT Microchip Technology, PIC24FJ192GA110-I/PT Datasheet - Page 27
![IC PIC MCU FLASH 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24FJ192GA110-I/PT
Manufacturer Part Number
PIC24FJ192GA110-I/PT
Description
IC PIC MCU FLASH 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets
1.PIC24FJ128GA008-IPT.pdf
(12 pages)
2.PIC24FJ128GA106-IPT.pdf
(14 pages)
3.PIC24FJ128GA106-IPT.pdf
(330 pages)
4.PIC24FJ128GA106-IPT.pdf
(52 pages)
5.PIC24FJ128GB110-IPF.pdf
(292 pages)
Specifications of PIC24FJ192GA110-I/PT
Core Size
16-Bit
Program Memory Size
192KB (65.5K x 24)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Controller Family/series
PIC24
No. Of I/o's
85
Ram Memory Size
16KB
Cpu Speed
32MHz
No. Of Timers
5
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
85
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDMA240015 - BOARD MCV PIM FOR 24F256GADM240011 - KIT STARTER MPLAB FOR PIC24F MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24FJ192GA110-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC24FJ192GA110-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC24FJ128GA008-IPT PDF datasheet
- PIC24FJ128GA106-IPT PDF datasheet #2
- PIC24FJ128GA106-IPT PDF datasheet #3
- PIC24FJ128GA106-IPT PDF datasheet #4
- PIC24FJ128GB110-IPF PDF datasheet #5
- Current page: 27 of 330
- Download datasheet (3Mb)
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins, and other
signals in close proximity to the oscillator, are benign
(i.e., free of high frequencies, short rise and fall times
and other similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
2010 Microchip Technology Inc.
Selection for rfPIC™ and PICmicro
and Design”
External Oscillator Pins
secondary
®
Oscillator Design”
®
oscillator
Oscillator Analysis
Figure
®
Devices”
for details).
2-5. In-line
(refer
PIC24FJ256GA110 FAMILY
to
FIGURE 2-5:
(tied to ground)
Bottom Layer
Copper Pour
Oscillator
Secondary
Primary
Oscillator
Crystal
GND
OSCO
OSCI
C1
C2
Sec Oscillator: C1
DEVICE PINS
(tied to ground)
Single-Sided and In-line Layouts:
Copper Pour
Fine-Pitch (Dual-Sided) Layouts:
`
`
Top Layer Copper Pour
SUGGESTED
PLACEMENT OF THE
OSCILLATOR CIRCUIT
(tied to ground)
`
Primary Oscillator
Sec Oscillator: C2
Crystal
DEVICE PINS
DS39905E-page 27
C2
C1
OSCI
OSCO
GND
SOSCO
SOSC I
Oscillator
Crystal
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