PIC16F876-20/SO Microchip Technology, PIC16F876-20/SO Datasheet - Page 498
PIC16F876-20/SO
Manufacturer Part Number
PIC16F876-20/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-20/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 5 Channel
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
5
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876-20/SO
Manufacturer:
MCI
Quantity:
56
Part Number:
PIC16F876-20/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 498 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
27.1
DS31027A-page 27-2
Introduction
The device configuration bits allow each user to customize certain aspects of the device to the
needs of the application. When the device powers up, the state of these bits determines the
modes that the device uses. Subsection
uration bits, and the modes that they can be configured to. These bits are mapped in program
memory location 2007h. This location is not accessible during normal device operation (can be
accessed only during programming mode).
The configuration bits can be programmed (read as '0') or left unprogrammed (read as '1') to
select various device configurations. The ability to change these settings once they have been
programmed depends on the memory technology and the package type.
For Read Only Memory (ROM) devices, these bits are specified at time of ROM code submittal
and once the device is masked may not be changed for those devices (would require a new mask
code).
For One Time Programmable (OTP) devices, once these bits are programmed (’0’), they may not
be changed.
For windowed EPROM devices, once these bits are programmed (’0’), the device must be UV
erased to return the configuration word to the erased state. UV erasing the device also erases
the program memory.
For Flash devices, these bits may be erased and reprogrammed.
Note:
Microchip does not recommend code protecting windowed devices.
27.2 “Configuration Word Bits”
1997 Microchip Technology Inc.
discusses the config-
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