PIC16F84-10I/P Microchip Technology, PIC16F84-10I/P Datasheet - Page 23

IC MCU FLASH 1KX14 EE 18DIP

PIC16F84-10I/P

Manufacturer Part Number
PIC16F84-10I/P
Description
IC MCU FLASH 1KX14 EE 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F84-10I/P

Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16F
No. Of I/o's
13
Eeprom Memory Size
64Byte
Ram Memory Size
68Byte
Cpu Speed
10MHz
No. Of Timers
1
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
68 B
Maximum Clock Frequency
10 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F84-10I/P
Quantity:
5
Part Number:
PIC16F84-10I/P
Quantity:
6
1.5.3.8
1.5.3.9
1.5.3.10
1.5.3.11
1.5.3.12
1997 Microchip Technology Inc.
ROM Devices
DIE
Specialized Services
Quick Turn Production (QTP) Programming
Serialized Quick Turn Production (SQTP
ROM devices have their program memory fixed at the time of the silicon manufacture. Since the
program memory cannot be changed, the device can be housed in the lower cost plastic pack-
age.
The DIE option allows the board size to become as small as physically possible. The DIE Support
document (DS30258) explains general information about using and designing with DIE. There
are also individual specification sheets that detail DIE specific information. Manufacturing with
DIE requires special knowledge and equipment. This means that the number of manufacturing
houses that support DIE will be limited. If you decide to use the DIE option, please research your
manufacturing sites to ensure that they will be able to meet the specialized requirements of DIE
use.
For OTP customers with established code, Microchip offers two specialized services. These two
services, Quick Turn Production Programming and Serialized Quick Turn Production Program-
ming, that allow customers to shorten their manufacturing cycle time.
Microchip offers this programming service for factory production orders. This service is made
available for users who choose not to program a medium to high quantity of units and whose code
patterns have stabilized. The devices are identical to the OTP devices but with all EPROM loca-
tions and configuration options already programmed by the factory. Certain code and prototype
verification procedures apply before production shipments are available. Please contact your
local Microchip sales office for more details.
Microchip offers a this unique programming service where a few user-defined locations in each
device are programmed with different serial numbers. The serial numbers may be random,
pseudo-random or sequential.
Serial programming allows each device to have a unique number which can serve as an
entry-code, password or ID number.
SM
) Programming
Section 1. Introduction
DS31001A-page 1-11
1

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