PIC18F2320-I/SP Microchip Technology, PIC18F2320-I/SP Datasheet - Page 372

IC MCU FLASH 4KX16 EEPROM 28DIP

PIC18F2320-I/SP

Manufacturer Part Number
PIC18F2320-I/SP
Description
IC MCU FLASH 4KX16 EEPROM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2320-I/SP

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F2220/2320/4220/4320
APPENDIX C:
This appendix discusses the considerations for con-
verting from previous versions of a device to the ones
listed in this data sheet. Typically, these changes are
due to the differences in the process technology used.
An example of this type of conversion is from a
PIC16C74A to a PIC16C74B.
DS39599C-page 370
Not Applicable
CONVERSION
CONSIDERATIONS
APPENDIX D:
This section discusses how to migrate from a Baseline
device (i.e., PIC16C5X) to an Enhanced MCU device
(i.e., PIC18FXXX).
The following are the list of modifications over the
PIC16C5X microcontroller family:
Not Currently Available
MIGRATION FROM
BASELINE TO
ENHANCED DEVICES
 2003 Microchip Technology Inc.

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