PIC18F2320-I/SP Microchip Technology, PIC18F2320-I/SP Datasheet - Page 33

• Manufacturer Part Number: PIC18F2320-I/SP
• Description: IC MCU FLASH 4KX16 EEPROM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2320-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 8KB (4K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SPI/I2C/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

6.0
TABLE 6-1:
 2010 Microchip Technology Inc.
Standard Operating Conditions
Operating Temperature: 25C is recommended
D110
D110A
D111
D112
D113
D031
D041
D080
D090
D012
P2
P2A
P2B
P3
P4
P5
P5A
P6
P9
P10
P11
P12
P13
P14
P15
Param
No.
AC/DC CHARACTERISTICS
V
V
V
I
I
V
V
V
V
C
Tsclk
TsclkL
TsclkH
Tset1
Thld1
Tdly1
Tdly1a
Tdly2
Tdly5
Tdly6
Tdly7
Thld2
Tset2
Tvalid
Tset3
PP
DDP
OL
OH
IHH
IH
DD
IL
IH
IO
Sym
L
TIMING REQUIREMENTS FOR PROGRAM/VERIFY TEST MODE
High-Voltage Programming Voltage on
MCLR/V
Low-Voltage Programming Voltage on
MCLR/V
Supply Voltage during Programming
Programming Current on MCLR/V
Supply Current during Programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O pin (PGD)
Serial Clock (Program Clock, PGC)
Period
Serial Clock (Program Clock, PGC) 
Low Time
Serial Clock (Program Clock, PGC) 
High Time
Input Data Setup Time to Serial Clock 
Input Data Hold Time from SCK
Delay between 4-bit Command and
Command Operand
Delay between 4-bit Command 
Operand and Next 4-bit Command
Delay between Last SCK  of 
Command Byte to First SCK  of Read
of Data Word
SCK High Time
(minimum programming time)
SCK Low Time after Programming
(high-voltage discharge time)
Delay to allow Self-Timed Data Write or
Bulk Erase to Occur
Input Data Hold Time from
MCLR/V
V
Data Out Valid from SCK 
PGM Setup Time to MCLR/V
DD
Setup Time to MCLR/V
PP
PP
PP

Characteristic
PP
PP


PP
V
0.8 V
DD
9.00
2.00
2.00
4.50
Min
V
100
400
400
100
40
40
15
15
20
20
20
10
10
—
—
—
—
1
1
5
2
2
SS
PIC18FX220/X320
– 0.7
DD
0.2 V
13.25
Max
5.50
5.50
5.50
V
300
0.6
50
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
DD
SS
Units
mA
ms
ms
A
pF
ns
s
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
ns
ns
s
V
V
V
V
V
V
V
V
Externally timed;
row erase and all
writes
Self-timed; all
bulk erases
I
I
To meet AC 
specifications
V
V
V
V
V
V
DS39592F-page 33
OL
OH
DD
DD
DD
DD
DD
DD
Conditions
= 8.5 mA
= -3.0 mA
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V