PIC16C66-04/SO Microchip Technology, PIC16C66-04/SO Datasheet - Page 4

• Manufacturer Part Number: PIC16C66-04/SO
• Description: IC MCU OTP 8KX14 PWM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C66-04/SO

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC16C
• No. Of I/o's: 22
• Ram Memory Size: 368Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 2
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2.5 V to 6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

SSP MODULE
REVISION HISTORY
Revision A Document (7/2002):
2
Original version (I
C Slave Issue).
Revision B Document (1/2003):
Clarification of original issue to include Restart
conditions. Addition of data sheet clarification 1 (SPI
Mode, CKE bit).
Revision C Document (3/2003):
Addition of data sheet clarification 2 (SPI Slave Mode,
operation).
Revision D Document (9/2004):
2
Updated list of affected devices for silicon issue 1 (I
C
– Slave Mode) and 2 (SSP – SPI, Slave Mode),
2
removed silicon issue 3 (I
C – Slave Mode). Updated
list of affected devices for data sheet clarification 1
(SSP – SPI Mode) and 2 (SSP – SPI Slave Mode).
2
Added data sheet clarification 3 (SSP – I
C Mode).
Revision E Document (7/2006):
Removed silicon issue 2 (SSP – SPI Slave Mode).
Revision F Document (2/2007):
Added four devices to list of devices affected by the
silicon errata and clarified the related language.
© 2007 Microchip Technology Inc.
DS80132F-page 4