PIC18F242-I/SP Microchip Technology, PIC18F242-I/SP Datasheet - Page 13

• Manufacturer Part Number: PIC18F242-I/SP
• Description: IC MCU FLASH 8KX16 EE A/D 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F242-I/SP

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC18
• No. Of I/o's: 23
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: MSSP, SPI, I2C, PSP, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 5 Channel
• Data Rom Size: 256 B
• A/d Bit Size: 10 bit
• A/d Channels Available: 5
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Details
• Other names: PIC18F242I/SP

PIC18FXX2
REVISION HISTORY
Rev A Document (10/2003)
First revision of this document. Listed silicon issues
1 (Core – Program Memory Space), 2 (Data
EEPROM), 3 and 4 (MSSP) and 5 (Core – Instruction
Set) and data sheet clarification issues 1 (DC
Characteristics), 2 (Low-Voltage Detect
Characteristics) and 3 (Packaging – Pinout and
Product Identification).
Rev B Document (05/2005)
Added silicon issue 6 (Reset).
Rev C Document (08/2005)
Moved silicon issue 4 (MSSP) to MSSP module errata
and added silicon issue 6 (Program Memory).
© 2005 Microchip Technology Inc.
DS80173C-page 13