DSPIC33FJ64MC506A-I/PT Microchip Technology, DSPIC33FJ64MC506A-I/PT Datasheet - Page 276
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DSPIC33FJ64MC506A-I/PT
Manufacturer Part Number
DSPIC33FJ64MC506A-I/PT
Description
IC DSPIC MCU/DSP 64K 64-TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Specifications of DSPIC33FJ64MC506A-I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
53
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
53
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64MC506A-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64MC506A-I/PTVAO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
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dsPIC33FJXXXMCX06A/X08A/X10A
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
DS70594B-page 276
DC5
dsPIC33FJXXXMCX06A/X08A/X10A
Extended Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
Note 1:
Param
No.
Operating Junction Temperature Range
DC Characteristics
P
I/O = ({V
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS vs. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– I
Range
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJXXXMCX06A/X08A/X10A
Min
Typ
-40
-40
-40
-40
40
40
40
40
28
(T
2009 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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