PIC24HJ128GP306-I/PT Microchip Technology, PIC24HJ128GP306-I/PT Datasheet - Page 283
PIC24HJ128GP306-I/PT
Manufacturer Part Number
PIC24HJ128GP306-I/PT
Description
IC PIC MCU FLASH 64KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206-IPT.pdf
(8 pages)
4.PIC24HJ64GP206-IPT.pdf
(20 pages)
5.PIC24HJ64GP206-IPT.pdf
(26 pages)
6.PIC24HJ128GP306-IPT.pdf
(288 pages)
Specifications of PIC24HJ128GP306-I/PT
Core Size
16-Bit
Program Memory Size
128KB (43K x 24)
Core Processor
PIC
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
16KB
Cpu Speed
40MIPS
No. Of Timers
13
No. Of Pwm Channels
8
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ128GP306-I/PT
Manufacturer:
MICROCHIP
Quantity:
455
Company:
Part Number:
PIC24HJ128GP306-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206-IPT PDF datasheet #2
- PIC24HJ64GP206-IPT PDF datasheet #3
- PIC24HJ64GP206-IPT PDF datasheet #4
- PIC24HJ64GP206-IPT PDF datasheet #5
- PIC24HJ128GP306-IPT PDF datasheet #6
- Current page: 283 of 292
- Download datasheet (5Mb)
TABLE A-2:
© 2009 Microchip Technology Inc.
Section 19.0 “Enhanced CAN
(ECAN™) Module”
Section 20.0 “10-Bit/12-Bit Analog-to-
Digital Converter (ADC)”
Section 21.0 “Special Features”
Section 24.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Changed bit 11 in the ECAN Control Register 1 (CiCTRL1) to Reserved
(see Register 19-1).
Added the ECAN Filter 15-8 Mask Selection (CiFMSKSEL2) register (see
Register 19-19).
Replaced the ADC Module Block Diagram (see Figure 20-1) and removed
Figure 21-2.
Added Note 2 to the Device Configuration Register Map (see Table 21-1)
Updated Typical values for Thermal Packaging Characteristics (see
Table 24-3).
Updated Min and Max values for parameter DC12 (RAM Data Retention
Voltage) and added Note 4 (see Table 24-4).
Updated Power-Down Current Max values for parameters DC60b and
DC60c (see Table 24-7).
Updated Characteristics for I/O Pin Input Specifications (see Table 24-9).
Updated Program Memory values for parameters 136, 137 and 138
(renamed to 136a, 137a and 138a), added parameters 136b, 137b and
138b, and added Note 2 (see Table 24-12).
Added parameter OS42 (G
(see Table 24-16).
Updated Watchdog Timer Time-out Period parameter SY20 (see
Table 24-21).
PIC24HJXXXGPX06/X08/X10
Update Description
M
) to the External Clock Timing Requirements
DS70175H-page 281
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